Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Fictiv Expands Global Manufacturing Network to Include Sheet Metal, Die Casting, Compression Molding
Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...
When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...
HARTWELL, Ga., Feb. 11, 2025 /PRNewswire/ -- Redline Plastics, a leader in rotational and compression molding, delivers complete, end-to-end manufacturing solutions across the Southeastern United ...
Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...
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